دورية أكاديمية
Influence of thermal shock cycles on Sn-37Pb solder bumps
| العنوان: | Influence of thermal shock cycles on Sn-37Pb solder bumps |
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| المؤلفون: | Gan, Guisheng, Xia, Da-quan, Liu, Xin, Liu, Cong, Cheng, Hanlin, Ming, Zhongzhen, Gao, Haoyang, Yang, Dong-hua, Wu, Yi-ping |
| المصدر: | Soldering & Surface Mount Technology, 2019, Vol. 31, Issue 2, pp. 85-92. |
| URL الوصول: | http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2018-0026 |
| قاعدة البيانات: | Emerald Insight |
Full Text Finder | تدمد: | 09540911 |
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| DOI: | 10.1108/SSMT-08-2018-0026 |