دورية أكاديمية
The Effect of Product Formulation, Substrate Solderability and Reflow Atmosphere on Solder Paste Reflow Performance
| العنوان: | The Effect of Product Formulation, Substrate Solderability and Reflow Atmosphere on Solder Paste Reflow Performance |
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| المؤلفون: | Warwick, M., Chowdhary, B.S., Stanton, N. |
| المصدر: | Soldering & Surface Mount Technology, 1995, Vol. 7, Issue 2, pp. 55-58. |
| URL الوصول: | http://www.emeraldinsight.com/doi/10.1108/eb037898 |
| قاعدة البيانات: | Emerald Insight |
Full Text Finder | تدمد: | 09540911 |
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| DOI: | 10.1108/eb037898 |