Reliability, Yield and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing and Software Development W. Kuo W. T. K. Chien T. Kim

التفاصيل البيبلوغرافية
العنوان:	Reliability, Yield and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing and Software Development W. Kuo W. T. K. Chien T. Kim
المؤلفون:	Samaniego, Francisco J.
المصدر:	Technometrics, 1999 Nov 01. 41(4), 371-372.
Relation:	Reliability, Yield and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing and Software Development W. Kuo W. T. K. Chien T. Kim
URL الوصول:	https://www.jstor.org/stable/1271359
قاعدة البيانات:	JSTOR Journals

الوصف
تدمد:	00401706
DOI:	10.2307/1271359