مورد إلكتروني
Fast Qualification of Solder Reliability in Solid-state Lighting System
| العنوان: | Fast Qualification of Solder Reliability in Solid-state Lighting System |
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| بيانات النشر: | 2015-04-24 |
| تفاصيل مُضافة: | Zhang, J. (author) |
| نوع الوثيقة: | Electronic Resource |
| مستخلص: | Solid-state lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future lighting applications. Since a bare LED die can hardly survive without a package, one of the most import function of the LED package is to facilitate the electrical connection and heat dissipation of the light engine mounted on a printed circuit board (PCB) by Land Grid Array (LGA) solder joints. These joints have been proven to be one of the most vulnerable link in the system. Therefore, evaluating the reliability of solder joints becomes vital to ensure the long term reliability of this new lighting product. A combined theoretical and experimental approach based on Finite Element (FE) calculations is a fast and commonly adopted way of estimating the solder reliability in microelectronics industry. However, there is no fatigue model that is particularly suitable for Land Grid Array (LGA) solder joints, which are mostly employed in board level LED packages. . Additionally, it would be desirable to have cruder engineering guidelines to quickly estimate the effect of the various geometries and dimensions for new trial LGA configurations. On the other hand, relatively accurate lifetime predictions still required Accelerated Life Tests (ALT). However, current reliability testing methods based on the detection of final catastrophic failure generally require very long test time (up to 9000 hours or 55 weeks), which does not meet the industrial target to limit the testing time to 6-12 weeks. A test method that is capable of carefully separating and in-situ monitoring the fatigue damages may be able to resolve the issue by offering the possibility of early termination of the test once enough information is collected to predict final and catastrophic failure. In addition, this capability can be attractive to make more accurate Remaining Useful Lifetime prognostic of solder joint in many critical electronics in other s Microelectronics & Computer Engineering Electrical Engineering, Mathematics and Computer Science |
| مصطلحات الفهرس: | solder reliability, non-destructive testing, solder fatigue, high precision electrical resistance measurement, in-situ fatigue damage monitoring, crack initiation, geometric effects, doctoral thesis, Text |
| URL: | 978-94-91909-24-5 |
| الإتاحة: | Open access content. Open access content (c) 2015 Zhang, J. |
| ملاحظة: | English |
| أرقام أخرى: | NLTUD oai:tudelft.nl:uuid:bf95c658-555a-45ee-a07e-394dfddd74ac 1008826288 |
| المصدر المساهم: | DELFT UNIV OF TECHNOL From OAIster®, provided by the OCLC Cooperative. |
| رقم الأكسشن: | edsoai.on1008826288 |
| قاعدة البيانات: | OAIster |
| الوصف غير متاح. |