مورد إلكتروني
Finite element analysis of hot melt adhesive joints in carton board
| العنوان: | Finite element analysis of hot melt adhesive joints in carton board |
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| بيانات النشر: | Örebro universitet, Institutionen för naturvetenskap och teknik Engineering and Physics, Karlstad University, Karlstad, Sweden BillerudKorsnäs, Frövi, Sweden Engineering and Chemical Sciences, Karlstad University, Karlstad, Sweden Solid Mechanics, KTH – Royal Institute of Technology, Stockholm, Sweden 2014 |
| تفاصيل مُضافة: | Hallbäck, Nils Korin, Christer Barbier, Christophe Nygårds, Mikael |
| نوع الوثيقة: | Electronic Resource |
| مستخلص: | The mechanical behaviour of adhesive joints is critical for the performance of adhesively joined carton board packages. In this work, finite element analyses of hot melt adhesive (HMA) joints in carton board is conducted and compared to experimental results obtained using a Y-peel testing device. The aim of the present study is to analyse the behaviour of adhesive joints tested in the Y-peel testing device using a layered carton board model. The carton board is modelled as a layered structure where the layers are assumed to obey Hill's orthotropic elastic-plastic model, and the interfaces are modelled using a softening orthotropic damage model. The HMA is modelled as isotropic linear elastic, and the influence from a varying elastic modulus of the HMA is explored. It is found that the pre-peak behaviour of the Y-peel force-elongation curves is reasonably well captured by the FE simulations, although the initial stiffness is somewhat too high. Also, the pre-peak behaviour is practically insensitive to changes of the elastic modulus of the HMA. The deformation and delamination pattern obtained in the simulations was compared with microscope pictures taken during the corresponding Y-peel experiments, and it is shown that they conform to the observed behaviour during Y-peel testing at comparable loading levels. However, the delamination opening is somewhat underestimated by the model. Funding Agency:Korsnäs AB |
| مصطلحات الفهرس: | carton board; adhesives; finite element simulation; fracture; delamination; Y-peel, Applied Mechanics, Teknisk mekanik, Article in journal, info:eu-repo/semantics/article, text |
| DOI: | 10.1002.pts.2060 |
| URL: | Packaging technology & science, 0894-3214, 2014, 27:9, s. 701-712 |
| الإتاحة: | Open access content. Open access content info:eu-repo/semantics/restrictedAccess |
| ملاحظة: | English |
| أرقام أخرى: | UPE oai:DiVA.org:oru-36541 doi:10.1002/pts.2060 ISI:000341142400003 1234025605 |
| المصدر المساهم: | UPPSALA UNIV LIBR From OAIster®, provided by the OCLC Cooperative. |
| رقم الأكسشن: | edsoai.on1234025605 |
| قاعدة البيانات: | OAIster |
| DOI: | 10.1002.pts.2060 |
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