Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component

التفاصيل البيبلوغرافية
العنوان:	Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component
المؤلفون:	Zain, Syed Mohamad Mardzukey Syed Mohamed^Aff26, Ani, Fakhrozi Che^Aff26, Ramli, Mohamad Riduwan^Aff26, Jalar, Azman^{Aff27, Aff28}, Bakar, Maria Abu^Aff27
المساهمون:	Kacprzyk, Janusz, Series Editor^Aff1, Pal, Nikhil R., Advisory Editor^Aff2, Bello Perez, Rafael, Advisory Editor^Aff3, Corchado, Emilio S., Advisory Editor^Aff4, Hagras, Hani, Advisory Editor^Aff5, Kóczy, László T., Advisory Editor^Aff6, Kreinovich, Vladik, Advisory Editor^Aff7, Lin, Chin-Teng, Advisory Editor^Aff8, Lu, Jie, Advisory Editor^Aff9, Melin, Patricia, Advisory Editor^Aff10, Nedjah, Nadia, Advisory Editor^Aff11, Nguyen, Ngoc Thanh, Advisory Editor^Aff12, Wang, Jun, Advisory Editor^Aff13, Mat Jizat, Jessnor Arif, editor^Aff14, Khairuddin, Ismail Mohd, editor^Aff15, Mohd Razman, Mohd Azraai, editor^Aff16, Ab. Nasir, Ahmad Fakhri, editor^Aff17, Abdul Karim, Mohamad Shaiful, editor^Aff18, Jaafar, Abdul Aziz, editor^Aff19, Hong, Lim Wei, editor^Aff20, Abdul Majeed, Anwar P. P., editor^Aff21, Liu, Pengcheng, editor^Aff22, Myung, Hyun, editor^Aff23, Choi, Han-Lim, editor^Aff24, Susto, Gian-Antonio, editor^Aff25
المصدر:	Advances in Robotics, Automation and Data Analytics : Selected Papers from iCITES 2020. 1350:309-314
قاعدة البيانات:	Springer Nature eBooks

الوصف
ردمك:	9783030709167 9783030709174
DOI:	10.1007/978-3-030-70917-4_29