كتاب إلكتروني
The Effect of Ion Implantation on Adhesive Bonding to, and Wear of, Copper and Copper-Base Alloys
العنوان: | The Effect of Ion Implantation on Adhesive Bonding to, and Wear of, Copper and Copper-Base Alloys |
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المؤلفون: | Bridge, T.Aff2, Procter, R. P. M.Aff2, Grant, W. A.Aff3, Ashworth, V.Aff2 |
المساهمون: | Kossowsky, Ram, editorAff1, Singhal, Subhash C., editorAff1 |
المصدر: | Surface Engineering : Surface Modification of Materials. 85:209-227 |
قاعدة البيانات: | Springer Nature eBooks |
ردمك: | 9789400962187 9789400962163 |
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DOI: | 10.1007/978-94-009-6216-3_16 |