دورية أكاديمية
Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing
| العنوان: | Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing |
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| المؤلفون: | Liang, ShuibaoAff1, Aff3, Jiang, HanAff2, Aff3, IDs11664023108535_cor2, Huang, Jiaqiang |
| المصدر: | Journal of Electronic Materials. 53(3):1192-1200 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
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| DOI: | 10.1007/s11664-023-10853-5 |