دورية أكاديمية
Study on the microstructure characteristics of melting marks in copper-clad aluminum wires under overcurrent faults
| العنوان: | Study on the microstructure characteristics of melting marks in copper-clad aluminum wires under overcurrent faults |
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| المؤلفون: | Wang, WeifengAff1, Aff2, Ji, XiaohanAff1, Aff2, IDs10973023126815_cor2, Zhang, FangzhiAff1, Aff2, IDs10973023126815_cor3, Zhao, XuanchongAff1, Aff2, Gui, XiaoyunAff1, Aff2, He, DiAff1, Aff2, Wang, LinAff1, Aff2 |
| المصدر: | Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 149(1):345-357 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 13886150 15882926 |
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| DOI: | 10.1007/s10973-023-12681-5 |