دورية أكاديمية
Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin Films
| العنوان: | Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin Films |
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| المؤلفون: | Lee, Pei-Ing, Wu, Po-Ching, Chuang, Tung-HanAff1, Aff2, IDs1166402209573z_cor3 |
| المصدر: | Journal of Electronic Materials. 51(7):3624-3636 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
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| DOI: | 10.1007/s11664-022-09573-z |