دورية أكاديمية
Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications
| العنوان: | Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al |
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| المؤلفون: | Kumaresan, VigneshwarramAff1, Aff2, Sreekantan, SrimalaAff1, Devarajan, Mutharasu, Mohamed, Khairudin |
| المصدر: | Journal of Materials Science: Materials in Electronics. 32(1):861-874 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 09574522 1573482X |
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| DOI: | 10.1007/s10854-020-04864-9 |