دورية أكاديمية
Effect of process parameters on filling behavior of PMMA in hot embossing
| العنوان: | Effect of process parameters on filling behavior of PMMA in hot embossing |
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| المؤلفون: | Li, Jianzhi, Liu, Jiashun, Gong, FengAff1, IDs0054202405624z_cor3, Yang, GaoAff1, IDs0054202405624z_cor4 |
| المصدر: | Microsystem Technologies: Micro- and NanosystemsInformation Storage and Processing Systems. 30(7):845-858 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 09467076 14321858 |
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| DOI: | 10.1007/s00542-024-05624-z |