دورية أكاديمية
Microstructure effects on thermal and electrical conductivities in the intermetallic compound Ag3Sn-based materials, sintered by SPS in view of die-attachment applications
| العنوان: | Microstructure effects on thermal and electrical conductivities in the intermetallic compound Ag3Sn-based materials, sintered by SPS in view of die-attachment applications |
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| المؤلفون: | Mahayri, R.Aff1, IDs11734022006137_cor1, Mercone, S., Giovannelli, F., Tan, K.-L., Morelle, J.-M., Jouini, N., Schoenstein, F. |
| المصدر: | The European Physical Journal Special Topics. 231(24):4173-4178 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 19516355 19516401 |
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| DOI: | 10.1140/epjs/s11734-022-00613-7 |