دورية أكاديمية
Modeling of step height reduction with temperature function in copper CMP
| العنوان: | Modeling of step height reduction with temperature function in copper CMP |
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| المؤلفون: | Shin, Yeongil, Jeong, Jongmin, Park, Youngwook, Jeong, Seonho, Jung, Hokyoung, Jeong, HaedoAff1, IDs1220602324141_cor6 |
| المصدر: | Journal of Mechanical Science and Technology. 37(12):6213-6220 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 1738494X 19763824 |
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| DOI: | 10.1007/s12206-023-2414-1 |