دورية أكاديمية
Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films
| العنوان: | Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films |
|---|---|
| المؤلفون: | Lai, Yu-Chang, Yang, Zi-Hong, Chen, Yin-Hsuan, Chen, Yen-Ting, Lin, Ang-Ying, Chuang, Tung-HanAff1, Aff2, IDs11665023085349_cor6 |
| المصدر: | Journal of Materials Engineering and Performance. :1-13 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 10599495 15441024 |
|---|---|
| DOI: | 10.1007/s11665-023-08534-9 |