دورية أكاديمية
Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films
العنوان: | Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films |
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المؤلفون: | Lai, Yu-Chang, Yang, Zi-Hong, Chen, Yin-Hsuan, Chen, Yen-Ting, Lin, Ang-Ying, Chuang, Tung-HanAff1, Aff2, IDs11665023085349_cor6 |
المصدر: | Journal of Materials Engineering and Performance. 33(16):8044-8056 |
قاعدة البيانات: | Springer Nature Journals |
تدمد: | 10599495 15441024 |
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DOI: | 10.1007/s11665-023-08534-9 |