دورية أكاديمية
Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages
| العنوان: | Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages |
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| المؤلفون: | Shih, M.-K.Aff1, IDs40799023006795_cor1, Liu, Y.-H., Lin, G.-S., Hsu, E., Yang, J. |
| المصدر: | Experimental Techniques: Developments, Applications and Tutorials in Experimental Mechanics and Dynamics. 48(4):599-609 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 07328818 17471567 |
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| DOI: | 10.1007/s40799-023-00679-5 |