دورية أكاديمية
Enhancement of vertical integration density by engineered BSOI wafers
| العنوان: | Enhancement of vertical integration density by engineered BSOI wafers |
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| المؤلفون: | Kaden, C., Langa, S., Ludewig, T., Schönberger, A., Herrmann, A., Göbel, A., Kolkovsky, V., Jeroch, W., Pufe, W. |
| المصدر: | Microsystem Technologies: Micro- and NanosystemsInformation Storage and Processing Systems. :1-6 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 09467076 14321858 |
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| DOI: | 10.1007/s00542-017-3522-6 |