دورية أكاديمية
Incorporating the Johnson–Cook Constitutive Model and a Soft Computational Approach for Predicting the High-Temperature Flow Behavior of Sn-5Sb Solder Alloy: A Comparative Study for Processing Map Development
| العنوان: | Incorporating the Johnson–Cook Constitutive Model and a Soft Computational Approach for Predicting the High-Temperature Flow Behavior of Sn-5Sb Solder Alloy: A Comparative Study for Processing Map Development |
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| المؤلفون: | Vafaeenezhad, H., Seyedein, S. H., Aboutalebi, M. R., Eivani, A. R. |
| المصدر: | Journal of Electronic Materials. January 2017 46(1):467-477 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
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| DOI: | 10.1007/s11664-016-4887-5 |