دورية أكاديمية
Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP
| العنوان: | Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP |
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| المؤلفون: | Zainudin, Wan Zamir Zakwan Wan, Yong, Tan ChouAff1, IDs10854022096610_cor2, Hui, Tan Cai, Kar, Yap BoonAff3, Aff4, Aff5, Hoong, Wong Yew |
| المصدر: | Journal of Materials Science: Materials in Electronics. 34(3) |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 09574522 1573482X |
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| DOI: | 10.1007/s10854-022-09661-0 |