دورية أكاديمية
Deposition and characterization for high-quality Ti–Ni–Cu thin films with higher Cu content
| العنوان: | Deposition and characterization for high-quality Ti–Ni–Cu thin films with higher Cu content |
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| المؤلفون: | Li, Jun, Yi, Xiao-Yang, Zheng, Yu, Wang, Jing, Wang, Hai-Zhen, Meng, Xiang-LongAff2, Gao, Zhi-Yong, Ma, Yue-Hui |
| المصدر: | Rare Metals. 40(8):2127-2133 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 10010521 18677185 |
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| DOI: | 10.1007/s12598-020-01489-z |