دورية أكاديمية
Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material
| العنوان: | Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material |
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| المؤلفون: | Lee, Jing Rou, Chong, Mun Xi, Abdul Aziz, Mohd SharizalAff1, IDs11664023107823_cor3, Khor, Chu Yee, Mohd Salleh, Mohd Arif Anuar, Mohd Arif Zainol, Mohd Remy Rozainy, Ani, F. Che |
| المصدر: | Journal of Electronic Materials. 53(3):1169-1182 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
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| DOI: | 10.1007/s11664-023-10782-3 |