دورية أكاديمية
A curing agent for epoxy resin based on microencapsulation of 1-butylimidazole
| العنوان: | A curing agent for epoxy resin based on microencapsulation of 1-butylimidazole |
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| المؤلفون: | Zhang, Binghong, Ma, AijieAff1, IDs10853022076444_cor2, Li, Jiaoyang, Xiao, Siyu, Li, Chunmei, Zhao, Weifeng, Zhang, Gai, Zhang, Hongli |
| المصدر: | Journal of Materials Science. 57(34):16541-16553 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 00222461 15734803 |
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| DOI: | 10.1007/s10853-022-07644-4 |