دورية أكاديمية
A curing agent for epoxy resin based on microencapsulation of 1-butylimidazole
العنوان: | A curing agent for epoxy resin based on microencapsulation of 1-butylimidazole |
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المؤلفون: | Zhang, Binghong, Ma, AijieAff1, IDs10853022076444_cor2, Li, Jiaoyang, Xiao, Siyu, Li, Chunmei, Zhao, Weifeng, Zhang, Gai, Zhang, Hongli |
المصدر: | Journal of Materials Science. 57(34):16541-16553 |
قاعدة البيانات: | Springer Nature Journals |
تدمد: | 00222461 15734803 |
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DOI: | 10.1007/s10853-022-07644-4 |