دورية أكاديمية
Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi0.5Sb1.5Te3 Thermoelectric Material and a Cu Electrode
| العنوان: | Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi |
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| المؤلفون: | Chuang, Tung-HanAff1, Hsu, Shih-Wen, Lin, Yan-Cheng, Yeh, Wei-Ting, Chen, Chun-Hao, Lee, Pei-Ing, Wu, Po-ChingAff1, Aff2, Cheng, Hao-Peng |
| المصدر: | Journal of Electronic Materials. 49(5):3391-3399 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
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| DOI: | 10.1007/s11664-020-08002-3 |