دورية أكاديمية
Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
| العنوان: | Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage |
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| المؤلفون: | Ni, Jiangfeng, Zhu, Xiaocui, Yuan, YifeiAff2, Aff3, Wang, Zhenzhu, Li, Yingbo, Ma, Lu, Dai, Alvin, Li, Matthew, Wu, Tianpin, Shahbazian-Yassar, Reza, Lu, Jun, Li, LiangAff1 |
| المصدر: | Nature Communications. 11(1) |
| قاعدة البيانات: | Springer Nature Journals |
Full Text Finder | تدمد: | 20411723 |
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| DOI: | 10.1038/s41467-020-15045-x |