دورية أكاديمية
Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping
| العنوان: | Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping |
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| المؤلفون: | Zhang, DanAff1, Aff2, Xu, Jing, Mao, ShujuanAff1, Aff2, Zhao, ChaoAff1, Aff2, Wang, Guilei, Luo, XueAff1, Aff2, Li, Junfeng, Li, Yongliang, Wang, WenwuAff1, Aff2, Chen, Dapeng, Ye, TianchunAff1, Aff2, Luo, JunAff1, Aff2 |
| المصدر: | Journal of Materials Science: Materials in Electronics. 30(11):10579-10588 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 09574522 1573482X |
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| DOI: | 10.1007/s10854-019-01402-0 |