دورية أكاديمية
Measurement of Sub-micron Deformations and Stresses at Microsecond Intervals in Laterally Impacted Composite Plates Using Digital Gradient Sensing
| العنوان: | Measurement of Sub-micron Deformations and Stresses at Microsecond Intervals in Laterally Impacted Composite Plates Using Digital Gradient Sensing |
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| المؤلفون: | Miao, C., Tippur, H. V.Aff1 |
| المصدر: | Journal of Dynamic Behavior of Materials. 4(3):336-358 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 21997446 21997454 |
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| DOI: | 10.1007/s40870-018-0156-4 |