دورية أكاديمية
Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors
| العنوان: | Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors |
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| المؤلفون: | Njoku, Jude E.Aff1, IDs1166402310340x_cor1, Amalu, Emeka H., Ekere, Ndy, Mallik, Sabuj, Ekpu, Mathias, Ogbodo, Eugene A. |
| المصدر: | Journal of Electronic Materials. 52(6):3786-3796 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
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| DOI: | 10.1007/s11664-023-10340-x |