دورية أكاديمية
Modeling and experiment of material removal rate for cutting single-crystal silicon by electrical discharge wire sawing
| العنوان: | Modeling and experiment of material removal rate for cutting single-crystal silicon by electrical discharge wire sawing |
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| المؤلفون: | Jia, Zhen, Li, ShujuanAff1, IDs00170024137961_cor2, Shao, Wei, Liu, Feilong, Ma, Gaoling, Dong, Yongheng, Shi, Haitao |
| المصدر: | The International Journal of Advanced Manufacturing Technology. :1-12 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 02683768 14333015 |
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| DOI: | 10.1007/s00170-024-13796-1 |