دورية أكاديمية
The Effect of Fillers on Thermal-Conductivity Materials Based on Silicon–Organic Oligomers (Review)
| العنوان: | The Effect of Fillers on Thermal-Conductivity Materials Based on Silicon–Organic Oligomers (Review) |
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| المؤلفون: | Ilyukhina, M. A.Aff1, IDS1995421222020058_cor1, Petrova, A. P., Timonin, V. V. |
| المصدر: | Polymer Science, Series D: Glues and Sealing Materials. 15(2):232-239 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 19954212 19954220 |
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| DOI: | 10.1134/s1995421222020058 |