دورية أكاديمية
Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices
| العنوان: | Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices |
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| المؤلفون: | Liu, Tao-Chi, Chen, Chih, Liu, Shih-Ting, Chang, Ming-Lun, Lin, Jandel |
| المصدر: | Journal of Materials Science: Materials in Electronics. October 2011 22(10):1536-1541 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 09574522 1573482X |
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| DOI: | 10.1007/s10854-011-0457-z |