دورية أكاديمية
Hybrid Solder Joint for Low-Temperature Bonding Application
| العنوان: | Hybrid Solder Joint for Low-Temperature Bonding Application |
|---|---|
| المؤلفون: | Lai, Yu-Yuan, Chao, Jui-Lin, Hsu, Chia-Jung, Wang, Chang-Meng, Wu, Albert T.Aff1, IDs11664022101110_cor5 |
| المصدر: | Journal of Electronic Materials. 52(2):782-791 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
|---|---|
| DOI: | 10.1007/s11664-022-10111-0 |