دورية أكاديمية
Hybrid Solder Joint for Low-Temperature Bonding Application
العنوان: | Hybrid Solder Joint for Low-Temperature Bonding Application |
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المؤلفون: | Lai, Yu-Yuan, Chao, Jui-Lin, Hsu, Chia-Jung, Wang, Chang-Meng, Wu, Albert T.Aff1, IDs11664022101110_cor5 |
المصدر: | Journal of Electronic Materials. 52(2):782-791 |
قاعدة البيانات: | Springer Nature Journals |
تدمد: | 03615235 1543186X |
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DOI: | 10.1007/s11664-022-10111-0 |