دورية أكاديمية
Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction
| العنوان: | Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction |
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| المؤلفون: | Lee, Jing Rou, Abdul Aziz, Mohd SharizalAff1, IDs11664023108553_cor2, Khor, Chu Yee, Ishak, Mohammad Hafifi Hafiz, Kamarudin, Roslan, Ani, F. Che |
| المصدر: | Journal of Electronic Materials. 53(3):1201-1213 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
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| DOI: | 10.1007/s11664-023-10855-3 |