دورية أكاديمية
Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis
| العنوان: | Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis |
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| المؤلفون: | Gupta, Nitin, Mahendran, Arunjunai RajAff1, IDs10973023128435_cor2, Weiss, Stephanie, Khalifa, Mohammed |
| المصدر: | Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 149(6):2609-2618 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 13886150 15882926 |
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| DOI: | 10.1007/s10973-023-12843-5 |