دورية أكاديمية

Small-size temperature/high-pressure integrated sensor via flip-chip method

التفاصيل البيبلوغرافية
العنوان: Small-size temperature/high-pressure integrated sensor via flip-chip method
المؤلفون: Huang, MimiAff1, Aff2, Aff3, Aff4, Wu, Xiaoyu, Zhao, LiboAff1, Aff2, Aff3, Aff5, Aff6, Han, XiangguangAff1, Aff2, Aff3, Aff5, IDs41378024007233_cor4, Xia, YongAff1, Aff2, Aff3, Aff5, IDs41378024007233_cor5, Gao, YiAff1, Aff2, Aff3, Aff4, Cui, ZeyuAff1, Aff2, Aff3, Aff5, Zhang, ChengAff1, Aff2, Aff3, Aff4, Yang, XiaokaiAff1, Aff2, Aff3, Aff4, Qiao, ZhixiaAff1, Aff2, Aff3, Aff4, Aff7, Li, ZhikangAff1, Aff2, Aff3, Aff5, Han, FengAff1, Aff2, Aff3, Aff5, Yang, PingAff1, Aff2, Aff3, Aff4, Aff5, Jiang, ZhuangdeAff1, Aff2, Aff3, Aff4
المصدر: Microsystems & Nanoengineering. 10(1)
قاعدة البيانات: Springer Nature Journals
الوصف
تدمد:20557434
DOI:10.1038/s41378-024-00723-3