دورية أكاديمية
Small-size temperature/high-pressure integrated sensor via flip-chip method
العنوان: | Small-size temperature/high-pressure integrated sensor via flip-chip method |
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المؤلفون: | Huang, MimiAff1, Aff2, Aff3, Aff4, Wu, Xiaoyu, Zhao, LiboAff1, Aff2, Aff3, Aff5, Aff6, Han, XiangguangAff1, Aff2, Aff3, Aff5, IDs41378024007233_cor4, Xia, YongAff1, Aff2, Aff3, Aff5, IDs41378024007233_cor5, Gao, YiAff1, Aff2, Aff3, Aff4, Cui, ZeyuAff1, Aff2, Aff3, Aff5, Zhang, ChengAff1, Aff2, Aff3, Aff4, Yang, XiaokaiAff1, Aff2, Aff3, Aff4, Qiao, ZhixiaAff1, Aff2, Aff3, Aff4, Aff7, Li, ZhikangAff1, Aff2, Aff3, Aff5, Han, FengAff1, Aff2, Aff3, Aff5, Yang, PingAff1, Aff2, Aff3, Aff4, Aff5, Jiang, ZhuangdeAff1, Aff2, Aff3, Aff4 |
المصدر: | Microsystems & Nanoengineering. 10(1) |
قاعدة البيانات: | Springer Nature Journals |
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