دورية أكاديمية
Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
| العنوان: | Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges |
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| المؤلفون: | Soon, Chin FhongAff1, Aff2, IDs12541024010272_cor1, Yee, See Khee, Nordin, Anis Nurashikin, Rahim, Rosminazuin Ab, Ma, Nyuk Ling, Hamed, Intan Sue Liana Abd, Tee, Kian Sek, Azmi, Nur Hanisah, Sunar, Norshuhaila Mohamed, Heng, Chris |
| المصدر: | International Journal of Precision Engineering and Manufacturing. :1-30 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 22347593 20054602 |
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| DOI: | 10.1007/s12541-024-01027-2 |