دورية أكاديمية
Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate
| العنوان: | Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate |
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| المؤلفون: | Wang, C. P., Dai, T., Lu, Y., Shi, Z., Ruan, J. J., Guo, Y. H., Liu, X. J. |
| المصدر: | Journal of Electronic Materials. August 2017 46(8):4891-4897 |
| قاعدة البيانات: | Springer Nature Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 03615235 1543186X |
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| DOI: | 10.1007/s11664-017-5477-x |