دورية أكاديمية

'How Do You Advance Here? How Do You Survive?' An Exploration of Underrepresented Minority Faculty Perceptions of Mentoring Modalities

التفاصيل البيبلوغرافية
العنوان: 'How Do You Advance Here? How Do You Survive?' An Exploration of Underrepresented Minority Faculty Perceptions of Mentoring Modalities
اللغة: English
المؤلفون: Espino, Michelle M., Zambrana, Ruth E.
المصدر: Review of Higher Education. Win 2019 42(2):457-484.
الإتاحة: Johns Hopkins University Press. 2715 North Charles Street, Baltimore, MD 21218. Tel: 800-548-1784; Tel: 410-516-6987; Fax: 410-516-6968; e-mail: jlorder@jhupress.jhu.edu; Web site: http://www.press.jhu.edu/journals/subscribe.html
Peer Reviewed: Y
Page Count: 28
تاريخ النشر: 2019
نوع الوثيقة: Journal Articles
Reports - Research
Education Level: Higher Education
Postsecondary Education
Descriptors: Minority Group Teachers, College Faculty, Mentors, Career Development, Equal Opportunities (Jobs), Social Networks, Cooperation, Teacher Collaboration, Teacher Researchers, Socialization, Individual Characteristics, Racial Bias, Ethnicity
DOI: 10.1353/rhe.2019.0003
تدمد: 0162-5748
مستخلص: This article contrasts perceptions among 58 under-represented minority (URM) faculty employed at U.S. research-extensive universities who reported an absence of mentoring or experienced informal or formal mentoring modalities. Key findings reveal a mentoring glass ceiling that affects URM faculty career paths: an absence of mentoring can lead to significant career miscalculations; well-intentioned mentors can devalue faculty scholarship; lack of senior faculty accountability for observed disengagement from faculty career development; and inadequate mentorship often limits access to social networks and collaborative research opportunities. Recommendations are offered for developing effective formal mentoring initiatives that reflect an institutional investment in early-career URM faculty.
Abstractor: As Provided
Number of References: 75
Entry Date: 2019
رقم الأكسشن: EJ1201678
قاعدة البيانات: ERIC
الوصف
تدمد:0162-5748
DOI:10.1353/rhe.2019.0003