دورية أكاديمية

Examining Adolescent Maltreatment and Connections to School Engagement

التفاصيل البيبلوغرافية
العنوان: Examining Adolescent Maltreatment and Connections to School Engagement
اللغة: English
المؤلفون: Mielityinen, Laura, Ellonen, Noora, Ikonen, Riikka, Paavilainen, Eija
المصدر: Improving Schools. Mar 2023 26(1):23-38.
الإتاحة: SAGE Publications. 2455 Teller Road, Thousand Oaks, CA 91320. Tel: 800-818-7243; Tel: 805-499-9774; Fax: 800-583-2665; e-mail: journals@sagepub.com; Web site: https://sagepub.com
Peer Reviewed: Y
Page Count: 16
تاريخ النشر: 2023
نوع الوثيقة: Journal Articles
Reports - Research
Tests/Questionnaires
Education Level: Junior High Schools
Middle Schools
Secondary Education
High Schools
Descriptors: Sexual Harassment, Child Neglect, Child Abuse, Learner Engagement, Foreign Countries, Sexual Abuse, Secondary School Students, Parent Child Relationship, Family Environment, Family Violence
مصطلحات جغرافية: Finland
DOI: 10.1177/13654802211056876
تدمد: 1365-4802
1475-7583
مستخلص: This article examines how maltreatment experienced by adolescents is related to school engagement. Maltreatment includes physical, mental, and sexual violence along with sexual harassment, neglect, and witnessing domestic violence. School engagement refers to the students' relationship to all activities in the school. It describes students' thoughts, activities and participation as well as their emotions in relation to school. Analysis is based on the Finnish School Health Promotion data (N = 155,299) and analyzed by linear regression analysis. Results indicate that adolescents' maltreatment experiences are related to school engagement, regardless of gender, age, family structure, or immigrant background. Maltreatment increases functional engagement and decreases emotional and cognitive engagement. These results thus confirm that maltreatment can also cause immersion in schoolwork. The results can be used to prevent lower school engagement and maltreatment of adolescents.
Abstractor: As Provided
Entry Date: 2023
رقم الأكسشن: EJ1381695
قاعدة البيانات: ERIC
الوصف
تدمد:1365-4802
1475-7583
DOI:10.1177/13654802211056876