دورية أكاديمية
Production of Microchips from Polystyrene Plates
| العنوان: | Production of Microchips from Polystyrene Plates |
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| اللغة: | English |
| المؤلفون: | Pace, Sarah Lindsey |
| المصدر: | NCSSSMST Journal. Spr 2009 14(2):13-15. |
| الإتاحة: | National Consortium for Specialized Secondary Schools of Mathematics, Science and Technology. 3020 Wards Ferry Road, Lynchburg, VA 24502. Tel: 434-582-1104; Fax: 434-239-4140; e-mail: office@ncsssmst.org; Web site: http://www.ncsssmst.org |
| Peer Reviewed: | N |
| وصف مادي: | |
| Page Count: | 3 |
| تاريخ النشر: | 2009 |
| نوع الوثيقة: | Journal Articles Reports - Research |
| Descriptors: | Technological Advancement, Science and Society, Influence of Technology, Conservation (Environment), Wastes, Efficiency, Printing, Electronics |
| تدمد: | 1084-6522 |
| مستخلص: | Currently manufactured microchips are expensive to make, require specialized equipment, and leave a large environmental footprint. To counter this, an alternative procedure that is cheaper and leaves a smaller environmental footprint should be made. The goal of this research project is to develop a process that creates microchips from polystyrene sheets. This was done by printing with ink on the polystyrene plate to create a mask. Then two methods of plating metal onto the circuit, electroless and electroplating, were tested. Time plated, procedure, and ink level were manipulated to achieve the best results. None of the samples were conductive. After investigation with a SEM, Scanning Electron Microscope, it was found that when the ink was heated, it shriveled and created cracks, or opens, in the circuit in all trials. Additional research was done to reduce the cracks in the shrinking process. However, the alternate methods did not reduce cracks. A third round of testing altered the method of measuring resistance, but damaged trials and had to be abandoned. Currently, there is no combination of variables that produced a working circuit, but significant advances have been made. Microchips created from this procedure would be for small scale applications, such as classrooms or home projects. In future research, microchips that could be used in electronics could reduce electronic waste. They could also lower costs of electronic devices, making them available to lower income markets. (Contains 1 table and 3 figures.) |
| Abstractor: | As Provided |
| Number of References: | 6 |
| Entry Date: | 2009 |
| رقم الأكسشن: | EJ855070 |
| قاعدة البيانات: | ERIC |
| تدمد: | 1084-6522 |
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